Guwahati, 13th March: In a significant development for the industrial landscape of Assam, Prime Minister Narendra Modi, on March 13, virtually laid the foundation stone for the state’s largest semiconductor unit in Morigaon.
The ambitious project, valued at Rs 27,000 crore, is being launched under the Assam Semiconductor Policy 2023 and entrusted to Tata Group’s Tata Semiconductor Assembly and Test (TSAT).
Expected to generate approximately 30,000 new jobs, the cutting-edge greenfield project is set to revolutionize employment opportunities in the region.
The facility is poised to emerge as a technological hub, boasting indigenous advanced semiconductor packaging technologies, including flip chip and ISIP technologies.
With a remarkable daily production capacity of 48 million units, the unit will cater to various sectors such as automotive, electric vehicles, consumer electronics, telecom, and mobile phones. Beyond its technological significance, the establishment of this semiconductor unit in Assam promises to drive economic growth and foster job creation in the area.
The focus will be on three key platform technologies – wire bond, flip chip, and integrated systems packaging (ISP). These technologies will facilitate the assembly and testing of semiconductor chips for a wide range of applications, spanning automotive, mobile devices, AI, and other vital segments. The first phase of the unit is slated to commence operations by the year 2025.
This decision marks a pivotal stride in stimulating growth and investment in the semiconductor sector within the region, which was once grappling with insurgency issues.
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